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Metallic & Material Data

Transport, thermodynamic, and quantum properties of metals and materials — resistivity, conductivity, Fermi energy, work function, and superconducting critical temperatures.

Source: CRC Handbook; Kittel; Ashcroft & Mermin

Electrical Resistivity

Electrical Resistivity ρ at 20 °C
Silver (Ag)1.59 × 10⁻⁸ Ω·m
Copper (Cu)1.68 ± 0.02× 10⁻⁸ Ω·m
Gold (Au)2.44 × 10⁻⁸ Ω·m
Aluminium (Al)2.65 × 10⁻⁸ Ω·m
Calcium (Ca)3.36 × 10⁻⁸ Ω·m
Magnesium (Mg)4.45 × 10⁻⁸ Ω·m
Tungsten (W)5.60 × 10⁻⁸ Ω·m
Zinc (Zn)5.90 × 10⁻⁸ Ω·m
Cobalt (Co)6.24 × 10⁻⁸ Ω·m
Nickel (Ni)6.99 × 10⁻⁸ Ω·m
Iron (Fe)10.0 ± 0.1× 10⁻⁸ Ω·m
Platinum (Pt)10.6 × 10⁻⁸ Ω·m
Tin (Sn)11.0 × 10⁻⁸ Ω·m
Molybdenum (Mo)5.47 × 10⁻⁸ Ω·m
Iridium (Ir)5.09 × 10⁻⁸ Ω·m
Rhodium (Rh)4.33 × 10⁻⁸ Ω·m
Chromium (Cr)12.7 × 10⁻⁸ Ω·m
Lead (Pb)20.8 × 10⁻⁸ Ω·m
Titanium (Ti)42.0 × 10⁻⁸ Ω·m
Bismuth (Bi)130 × 10⁻⁸ Ω·m
Mercury (Hg, liq.)98.0 × 10⁻⁸ Ω·m
Stainless steel 304~72 × 10⁻⁸ Ω·m
Graphite (⊥ layers)~50 000 × 10⁻⁸ Ω·m
Temperature Coefficient of Resistivity α (at 20 °C)
Silver (Ag)3.8 × 10⁻³ K⁻¹
Copper (Cu)3.9 × 10⁻³ K⁻¹
Gold (Au)3.4 × 10⁻³ K⁻¹
Aluminium (Al)3.9 × 10⁻³ K⁻¹
Tungsten (W)4.5 × 10⁻³ K⁻¹
Iron (Fe)5.0 × 10⁻³ K⁻¹
Nickel (Ni)6.0 × 10⁻³ K⁻¹
Platinum (Pt)3.92 × 10⁻³ K⁻¹
Lead (Pb)3.9 × 10⁻³ K⁻¹
Nichrome (NiCr)0.4 × 10⁻³ K⁻¹
Manganin0.002 × 10⁻³ K⁻¹

Thermal Conductivity

Thermal Conductivity κ at 25 °C
Diamond1 000–2 200 W m⁻¹ K⁻¹
Silver (Ag)429 W m⁻¹ K⁻¹
Copper (Cu)401 W m⁻¹ K⁻¹
Gold (Au)318 W m⁻¹ K⁻¹
Aluminium (Al)237 W m⁻¹ K⁻¹
Beryllium (Be)200 W m⁻¹ K⁻¹
Tungsten (W)174 W m⁻¹ K⁻¹
Magnesium (Mg)156 W m⁻¹ K⁻¹
Zinc (Zn)116 W m⁻¹ K⁻¹
Nickel (Ni)91 W m⁻¹ K⁻¹
Iron (Fe)80 W m⁻¹ K⁻¹
Platinum (Pt)71.6 W m⁻¹ K⁻¹
Tin (Sn)67 W m⁻¹ K⁻¹
Titanium (Ti)21.9 W m⁻¹ K⁻¹
Lead (Pb)35.3 W m⁻¹ K⁻¹
Stainless steel 30416.2 W m⁻¹ K⁻¹
Silicon (Si)148 W m⁻¹ K⁻¹
Germanium (Ge)60 W m⁻¹ K⁻¹
Boron nitride (h-BN)~400 W m⁻¹ K⁻¹
Alumina (Al₂O₃)30 W m⁻¹ K⁻¹
Glass (borosilicate)1.14 W m⁻¹ K⁻¹
Water (liquid)0.606 W m⁻¹ K⁻¹
Air (1 atm)0.0257 W m⁻¹ K⁻¹

Fermi Energy & Free-Electron Density

Fermi Energy EF (free-electron model)
Lithium (Li)4.74 eV
Sodium (Na)3.24 eV
Potassium (K)2.12 eV
Rubidium (Rb)1.85 eV
Caesium (Cs)1.59 eV
Copper (Cu)7.04 eV
Silver (Ag)5.49 eV
Gold (Au)5.53 eV
Beryllium (Be)14.3 eV
Magnesium (Mg)7.08 eV
Calcium (Ca)4.69 eV
Aluminium (Al)11.7 eV
Zinc (Zn)9.47 eV
Iron (Fe)11.1 eV
Lead (Pb)9.47 eV
Tin (Sn)10.2 eV
Free-Electron Density n
Lithium (Li)4.70 × 10²⁸ m⁻³
Sodium (Na)2.65 × 10²⁸ m⁻³
Potassium (K)1.40 × 10²⁸ m⁻³
Copper (Cu)8.49 × 10²⁸ m⁻³
Silver (Ag)5.86 × 10²⁸ m⁻³
Gold (Au)5.90 × 10²⁸ m⁻³
Aluminium (Al)18.1 × 10²⁸ m⁻³
Iron (Fe)17.0 × 10²⁸ m⁻³
Fermi Temperature TF = EF/kB
Copper (Cu)81 700 K
Aluminium (Al)135 800 K
Fermi Velocity vF
Copper (Cu)1.57 × 10⁶ m s⁻¹
Aluminium (Al)2.03 × 10⁶ m s⁻¹

Work Functions

Work Function φ (polycrystalline unless noted)
Caesium (Cs)2.1 eV
Rubidium (Rb)2.16 eV
Potassium (K)2.3 eV
Sodium (Na)2.36 eV
Lithium (Li)2.93 eV
Barium (Ba)2.52 eV
Calcium (Ca)2.87 eV
Magnesium (Mg)3.66 eV
Aluminium (Al)4.28 ± 0.05eV
Zinc (Zn)3.63 eV
Lead (Pb)4.25 eV
Tin (Sn)4.42 eV
Silver (Ag)4.26–4.74 eV
Copper (Cu)4.65 ± 0.05eV
Niobium (Nb)4.3 eV
Molybdenum (Mo)4.6 eV
Chromium (Cr)4.5 eV
Iron (Fe)4.81 eV
Nickel (Ni)5.15 ± 0.10eV
Cobalt (Co)5.0 eV
Tungsten (W)4.55 ± 0.05eV
Tantalum (Ta)4.25 eV
Rhenium (Re)4.96 eV
Osmium (Os)4.83 eV
Iridium (Ir)5.27 eV
Platinum (Pt)5.65 ± 0.05eV
Gold (Au)5.1 ± 0.1eV
Silicon (n-type)4.05–4.2 eV
Germanium4.0 eV
ITO (In₂O₃:Sn)4.4–4.9 eV

Superconducting Critical Temperatures

Elemental Superconductors — Tc
Rhodium (Rh)3.25 × 10⁻⁴ K
Tungsten (W)1.5 × 10⁻³ K
Iridium (Ir)0.1125 ± 0.001K
Aluminium (Al)1.175 ± 0.002K
Zinc (Zn)0.850 ± 0.001K
Titanium (Ti)0.40 ± 0.04K
Rhenium (Re)1.697 ± 0.006K
Indium (In)3.408 ± 0.001K
Tin (Sn)3.722 ± 0.001K
Tantalum (Ta)4.47 ± 0.04K
Mercury α (Hg)4.154 ± 0.001K
Lead (Pb)7.196 ± 0.006K
Vanadium (V)5.40 ± 0.05K
Lanthanum β (La)6.00 K
Niobium (Nb) — highest elemental9.26 ± 0.02K
Conventional Compounds (BCS) — Tc
NbTi9.8 K
NbN16.0 K
V₃Si17.1 K
Nb₃Sn18.3 K
K₃C₆₀ (fulleride)18.0 K
Nb₃Ge — highest conventional (1973)23.2 K
MgB₂ (2001)39 ± 1K
Cuprate High-Tc — Tc
(La,Ba)₂CuO₄ — first cuprate (Bednorz & Müller 1986)38 K
YBa₂Cu₃O₇ (YBCO) — first above LN₂92 ± 1K
Bi₂Sr₂CaCu₂O₈ (Bi-2212)85 K
Bi₂Sr₂Ca₂Cu₃O₁₀ (Bi-2223)108 K
Tl₂Ba₂Ca₂Cu₃O₁₀ (Tl-2223)127 K
HgBa₂Ca₂Cu₃O₈ (Hg-1223) — highest ambient-pressure Tc134 ± 1K
Iron-Based Superconductors — Tc
LaFeAsO₁₋ₓFₓ (La-1111)26 K
SmFeAsO₁₋ₓFₓ (Sm-1111)55 K
Ba₀.₆K₀.₄Fe₂As₂ (122)38 K
Hydride Superconductors (under pressure) — Tc
H₃S at ~150 GPa (2015)203 ± 2K
LaH₁₀ at ~170 GPa (2018)250–260 K
CaH₆ at ~172 GPa (2022)~215 K
Critical Magnetic Fields — Hc (Type I) at 0 K
Aluminium (Al)10.5 mT
Lead (Pb)80.3 mT
Mercury (Hg)41.1 mT
Upper Critical Field Hc₂ at 0 K (Type II)
Nb₃Sn29.5 T
NbTi15 T
YBCO~100 T

Density, Melting Point & Boiling Point

Density ρ at 20 °C
Osmium (Os) — densest element22 590 ± 15kg m⁻³
Iridium (Ir)22 560 ± 10kg m⁻³
Platinum (Pt)21 450 kg m⁻³
Rhenium (Re)21 020 kg m⁻³
Tungsten (W)19 300 kg m⁻³
Gold (Au)19 300 kg m⁻³
Uranium (U)19 100 kg m⁻³
Lead (Pb)11 340 kg m⁻³
Silver (Ag)10 490 kg m⁻³
Copper (Cu)8 960 kg m⁻³
Nickel (Ni)8 908 kg m⁻³
Iron (Fe)7 874 kg m⁻³
Tin (Sn)7 265 kg m⁻³
Zinc (Zn)7 133 kg m⁻³
Titanium (Ti)4 507 kg m⁻³
Aluminium (Al)2 700 kg m⁻³
Silicon (Si)2 329 kg m⁻³
Magnesium (Mg)1 738 kg m⁻³
Lithium (Li) — lightest metal534 kg m⁻³
Water (H₂O, 4 °C)999.97 kg m⁻³
Melting Point Tm
Tungsten (W) — highest of all elements3 695 ± 3K (3422 °C)
Rhenium (Re)3 459 ± 3K (3186 °C)
Osmium (Os)3 306 ± 30K (3033 °C)
Tantalum (Ta)3 290 ± 10K (3017 °C)
Molybdenum (Mo)2 896 ± 2K (2623 °C)
Niobium (Nb)2 750 ± 2K (2477 °C)
Iridium (Ir)2 719 ± 3K (2446 °C)
Platinum (Pt)2 041 ± 1K (1768 °C)
Iron (Fe)1 811 ± 1K (1538 °C)
Nickel (Ni)1 728 ± 1K (1455 °C)
Copper (Cu)1 358 ± 1K (1085 °C)
Gold (Au)1 337 ± 1K (1064 °C)
Silver (Ag)1 235 ± 1K (962 °C)
Aluminium (Al)933.5 ± 0.1K (660 °C)
Lead (Pb)600.6 ± 0.1K (327 °C)
Tin (Sn)505.1 ± 0.1K (232 °C)
Gallium (Ga)302.9 ± 0.1K (29.8 °C)
Caesium (Cs)301.6 ± 0.1K (28.5 °C)
Mercury (Hg) — liquid at room temperature234.3 ± 0.1K (−38.9 °C)
Helium (He) — does not solidify at 1 atm< 0.95 K (requires pressure)
Boiling Point Tb
Tungsten (W)6 203 ± 300K (5930 °C)
Iron (Fe)3 134 K (2861 °C)
Copper (Cu)2 835 K (2562 °C)
Silver (Ag)2 435 K (2162 °C)
Gold (Au)3 129 K (2856 °C)
Aluminium (Al)2 743 K (2470 °C)
Nitrogen (N₂)77.36 K (−195.8 °C)
Oxygen (O₂)90.19 K (−183.0 °C)
Helium (He)4.222 K (−269.0 °C)
Hydrogen (H₂)20.27 K (−252.9 °C)

Elastic Moduli & Thermal Properties

Young's Modulus E
Diamond~1 050 GPa
Tungsten (W)411 GPa
Osmium (Os)590 GPa
Iridium (Ir)528 GPa
Iron (Fe)211 GPa
Nickel (Ni)200 GPa
Copper (Cu)128 ± 5GPa
Silicon (Si)130–185 GPa
Titanium (Ti)116 GPa
Gold (Au)79 GPa
Silver (Ag)83 GPa
Aluminium (Al)69 GPa
Lead (Pb)16 GPa
Debye Temperature θD
Diamond2 230 K
Beryllium (Be)1 440 K
Iron (Fe)470 K
Silicon (Si)645 K
Aluminium (Al)428 K
Copper (Cu)343 K
Silver (Ag)225 K
Gold (Au)170 K
Lead (Pb)105 K
Specific Heat Capacity cp at 25 °C
Lithium (Li)3 582 J kg⁻¹ K⁻¹
Beryllium (Be)1 825 J kg⁻¹ K⁻¹
Magnesium (Mg)1 023 J kg⁻¹ K⁻¹
Aluminium (Al)897 J kg⁻¹ K⁻¹
Titanium (Ti)520 J kg⁻¹ K⁻¹
Iron (Fe)449 J kg⁻¹ K⁻¹
Nickel (Ni)444 J kg⁻¹ K⁻¹
Copper (Cu)385 J kg⁻¹ K⁻¹
Silver (Ag)235 J kg⁻¹ K⁻¹
Tungsten (W)132 J kg⁻¹ K⁻¹
Gold (Au)129 J kg⁻¹ K⁻¹
Lead (Pb)128 J kg⁻¹ K⁻¹
Water (H₂O)4 182 J kg⁻¹ K⁻¹
Linear Thermal Expansion α at 25 °C
Tungsten (W)4.5 × 10⁻⁶ K⁻¹
Silicon (Si)2.6 × 10⁻⁶ K⁻¹
Iron (Fe)11.8 × 10⁻⁶ K⁻¹
Nickel (Ni)13.0 × 10⁻⁶ K⁻¹
Copper (Cu)16.5 × 10⁻⁶ K⁻¹
Gold (Au)14.2 × 10⁻⁶ K⁻¹
Aluminium (Al)23.1 × 10⁻⁶ K⁻¹
Lead (Pb)28.9 × 10⁻⁶ K⁻¹
Invar (Fe₆₄Ni₃₆)1.2 × 10⁻⁶ K⁻¹

Semiconductor Band Gaps & Carrier Properties

Indium antimonide (InSb) — narrow gap
Band gap Eg0.180 ± 0.001eV (direct)
Electron mobility μe77 000 cm² V⁻¹ s⁻¹
Indium arsenide (InAs)
Band gap Eg0.354 ± 0.001eV (direct)
Electron mobility μe33 000 cm² V⁻¹ s⁻¹
Germanium (Ge)
Band gap Eg0.6610 ± 0.0001eV (indirect)
Band gap Eg (4 K)0.7437 eV (indirect)
Electron mobility μe3 900 cm² V⁻¹ s⁻¹
Hole mobility μh1 900 cm² V⁻¹ s⁻¹
Intrinsic carrier density ni2.4 × 10¹³ cm⁻³
Indium phosphide (InP)
Band gap Eg1.344 eV (direct)
Electron mobility μe4 600 cm² V⁻¹ s⁻¹
Silicon (Si)
Band gap Eg1.1242 ± 0.0001eV (indirect)
Band gap Eg (4 K)1.1692 eV
Electron mobility μe1 450 cm² V⁻¹ s⁻¹
Hole mobility μh450 cm² V⁻¹ s⁻¹
Intrinsic carrier density ni1.07 × 10¹⁰ cm⁻³
Relative permittivity εr11.7
Breakdown field Ebreak3 × 10⁵ V cm⁻¹
Gallium arsenide (GaAs)
Band gap Eg1.422 ± 0.001eV (direct)
Electron mobility μe8 500 cm² V⁻¹ s⁻¹
Hole mobility μh400 cm² V⁻¹ s⁻¹
Relative permittivity εr12.9
Gallium phosphide (GaP)
Band gap Eg2.26 eV (indirect)
Gallium nitride (GaN) — wide gap
Band gap Eg3.44 ± 0.01eV (direct)
Electron mobility μe1 000 cm² V⁻¹ s⁻¹
Breakdown field Ebreak~5 × 10⁶ V cm⁻¹
Silicon carbide 4H-SiC — wide gap
Band gap Eg3.23 eV (indirect)
Electron mobility μe900 cm² V⁻¹ s⁻¹
Breakdown field Ebreak~3 × 10⁶ V cm⁻¹
Zinc oxide (ZnO)
Band gap Eg3.44 eV (direct)
Aluminium nitride (AlN)
Band gap Eg6.2 eV (direct)
Diamond — ultra-wide gap
Band gap Eg5.47 eV (indirect)
Electron mobility μe2 200 cm² V⁻¹ s⁻¹
Breakdown field Ebreak~10⁷ V cm⁻¹
Thermal conductivity1 000–2 200 W m⁻¹ K⁻¹
Graphene (2D)
Band gap Eg0 (semimetal)
Electron mobility μe (suspended)~200 000 cm² V⁻¹ s⁻¹
Fermi velocity vF1.0 × 10⁶ m s⁻¹
MoS₂ monolayer (2D)
Band gap Eg (direct, monolayer)1.8 eV (direct)
Band gap Eg (indirect, bulk)1.2 eV (indirect)